Thailand Aims for 2.5 Trillion Baht Chip Investment by 2030
Thailand's government approved a three-phase semiconductor industry roadmap targeting 2.5 trillion baht in investment by 2039, aiming to transform the country from an electronics assembly hub into a chip manufacturing and design center. The
Thailand's national semiconductor and advanced electronics policy board has approved a three-phase development roadmap targeting photonics, power semiconductors, and sensors, with 500 billion baht in investment over five years. According to Naruetom Terdsteeraksorn, secretary-general of the Board of Investment (BOI), the meeting held on September 24, 2026, chaired by Deputy Prime Minister and Finance Minister Ekniti Nititangtharaprasoet, endorsed the "National Semiconductor and Advanced Electronics Industry Development Strategy" to build a complete Thai chip industry foundation and push toward the "Made in Thailand Chips" goal. The strategy targets attracting 500 billion baht by 2029 and over 2.5 trillion baht by 2039, while expanding industry revenue to 5 trillion baht and creating over 230,000 jobs, aiming to shift Thailand from an electronics assembly base to a semiconductor manufacturing and technology development hub with greater involvement in global supply chains.
The roadmap spans three phases: Phase One (by 2029) will strengthen chip assembly and testing capabilities, advancing to high-end assembly and testing to lay the foundation for upstream chip production. Phase Two (by 2034) will accelerate investment in chip design, wafer fabrication, and advanced manufacturing technology. Phase Three (by 2039) aims to establish a complete supply chain and develop Thai businesses into "Local Champions" capable of driving innovation and connecting to global markets.
The three target industries are photonics (light-based data transmission and processing for AI and data centers), power semiconductors (for electric vehicles and energy storage), and sensors (building on Thailand's MEMS technology toward IoT and smart devices). The strategy emphasizes building capabilities in integrated circuit design and advanced packaging technologies including Bumping, RDL, wafer-level packaging, and 2.5D/3D packaging. Implementation will use five mechanisms: investment incentives, skilled workforce development, technology, infrastructure, and business environment, supported by tailor-made packages for target investors, technology centers, and prepared industrial zones with utilities and waste management.
The meeting also approved the "Siam Silica" workforce plan, targeting 86,600 trained personnel by 2029—84,900 skilled workers and approximately 1,700 senior researchers—through specialized curricula, training, and domestic and overseas internships, including development of instructors, researchers, and trainers for chip design, manufacturing, assembly, testing, advanced electronics, and quantum technology. Terdsteeraksorn noted that major company investments already reflect Thailand's potential, with Infineon Technologies preparing to expand operations.